Ag-based filler metal wetting behavior and brazed joint performance on SLMed Ti/TiB2 substrate

IF 1.7 4区材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Soldering & Surface Mount Technology Pub Date : 2024-06-05 DOI:10.1108/ssmt-12-2023-0079

Liuyong Wang, Qi Wu, Ziming Song, Yue Li, Xuewen Li, Bing Tu, Yulong Li

{"title":"Ag-based filler metal wetting behavior and brazed joint performance on SLMed Ti/TiB2 substrate","authors":"Liuyong Wang, Qi Wu, Ziming Song, Yue Li, Xuewen Li, Bing Tu, Yulong Li","doi":"10.1108/ssmt-12-2023-0079","DOIUrl":null,"url":null,"abstract":"<h3>Purpose</h3>\n<p>This study aims to investigate the wetting behavior of AgCuTi and AgCu filler metals on selective laser melting (SLMed) Ti/TiB<sub>2</sub>, and to analyze the microstructure and fracture characteristics of SLMed Ti/TiB<sub>2</sub>/AgCuTi or AgCu alloy/SLMed Ti/TiB<sub>2</sub> brazed joints. The wetting behavior of AgCuTi and AgCu filler metals on the selective laser melted (SLMed) Ti/TiB<sub>2</sub> has been studied. The analysis of microstructures and fracture characteristics in vacuum-brazed SLMed Ti/TiB<sub>2</sub> substrate, using AgCuTi and AgCu filler metals, has been conducted to elucidate the influence of brazing temperature and alloy composition on the shear strength of the brazed joints.</p>\n<h3>Design/methodology/approach</h3>\n<p>Brazing SLMed-Ti/TiB<sub>2</sub> in a vacuum using AgCuTi and AgCu filler metals, this study aims to explore the optimal parameters for brazed joints at various brazing temperatures (800°C−950°C).</p>\n<h3>Findings</h3>\n<p>The findings suggest that elevated brazing temperatures lead to a more extensive diffusion region in the joint as a result of the partial melting of the filler metal. The joint composition changes from distinct Ti<sub>2</sub>Cu layer/TiCu layer/filler metal to a-Ti (ss) + ß-Ti (ss)/TiCu. As the brazing temperature increases, the fracture mode shifts from brittle cleavage to ductile fracture, mainly attributed to a decrease in the CuTi within the brazed joint. This change in fracture behavior indicates an improvement in the ductility and toughness of the joint.</p>\n<h3>Originality/value</h3>\n<p>The originality of this study lies in the comprehensive analysis of the microstructure and shear strength of vacuum brazing SLMed Ti/TiB<sub>2</sub> using AgCuTi and AgCu filler metals.</p>","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":"43 1","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2024-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Soldering & Surface Mount Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1108/ssmt-12-2023-0079","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

Abstract

Purpose

This study aims to investigate the wetting behavior of AgCuTi and AgCu filler metals on selective laser melting (SLMed) Ti/TiB₂, and to analyze the microstructure and fracture characteristics of SLMed Ti/TiB₂/AgCuTi or AgCu alloy/SLMed Ti/TiB₂ brazed joints. The wetting behavior of AgCuTi and AgCu filler metals on the selective laser melted (SLMed) Ti/TiB₂ has been studied. The analysis of microstructures and fracture characteristics in vacuum-brazed SLMed Ti/TiB₂ substrate, using AgCuTi and AgCu filler metals, has been conducted to elucidate the influence of brazing temperature and alloy composition on the shear strength of the brazed joints.

Design/methodology/approach

Brazing SLMed-Ti/TiB₂ in a vacuum using AgCuTi and AgCu filler metals, this study aims to explore the optimal parameters for brazed joints at various brazing temperatures (800°C−950°C).

Findings

The findings suggest that elevated brazing temperatures lead to a more extensive diffusion region in the joint as a result of the partial melting of the filler metal. The joint composition changes from distinct Ti₂Cu layer/TiCu layer/filler metal to a-Ti (ss) + ß-Ti (ss)/TiCu. As the brazing temperature increases, the fracture mode shifts from brittle cleavage to ductile fracture, mainly attributed to a decrease in the CuTi within the brazed joint. This change in fracture behavior indicates an improvement in the ductility and toughness of the joint.

Originality/value

The originality of this study lies in the comprehensive analysis of the microstructure and shear strength of vacuum brazing SLMed Ti/TiB₂ using AgCuTi and AgCu filler metals.

查看原文本刊更多论文

银基填充金属在 SLMed Ti/TiB2 基材上的润湿行为和钎焊接头性能

目的本研究旨在探讨 AgCuTi 和 AgCu 填充金属在选择性激光熔化 (SLMed) Ti/TiB2 上的润湿行为，并分析 SLMed Ti/TiB2/AgCuTi 或 AgCu 合金/SLMed Ti/TiB2 焊接接头的微观结构和断裂特性。研究了选择性激光熔化 (SLMed) Ti/TiB2 上 AgCuTi 和 AgCu 填充金属的润湿行为。使用 AgCuTi 和 AgCu 填充金属对真空钎焊 SLMed Ti/TiB2 基材的微观结构和断裂特性进行了分析，以阐明钎焊温度和合金成分对钎焊接头剪切强度的影响。研究结果研究结果表明，由于填充金属部分熔化，钎焊温度升高会导致接头中出现更广泛的扩散区域。接合处的成分从不同的 Ti2Cu 层/TiCu 层/填充金属变为 a-Ti (ss) + ß-Ti (ss)/TiCu 。随着钎焊温度的升高，断裂模式从脆性劈裂转变为韧性断裂，这主要归因于钎焊接头内 CuTi 的减少。本研究的独创性在于使用 AgCuTi 和 AgCu 填充金属全面分析了真空钎焊 SLMed Ti/TiB2 的微观结构和剪切强度。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Soldering & Surface Mount Technology 工程技术-材料科学：综合

CiteScore

4.10

自引率

15.00%

发文量

审稿时长

>12 weeks

期刊介绍： Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.