BEOL-Compatible Ferroelectric Capacitor of 5 nm Ultrathin HZO With High Remanent Polarization and Excellent Endurance

IF 2.1 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Li-Cheng Teng;Yu-Che Huang;Shu-Jui Chang;Shin-Yuan Wang;Yu-Hsien Lin;Chao-Hsin Chien
{"title":"BEOL-Compatible Ferroelectric Capacitor of 5 nm Ultrathin HZO With High Remanent Polarization and Excellent Endurance","authors":"Li-Cheng Teng;Yu-Che Huang;Shu-Jui Chang;Shin-Yuan Wang;Yu-Hsien Lin;Chao-Hsin Chien","doi":"10.1109/TNANO.2024.3407817","DOIUrl":null,"url":null,"abstract":"In this letter, we have successfully fabricated a metal-ferroelectricity-metal (MFM) capacitor of an ultrathin 5 nm HZO utilizing Molybdenum (Mo) as the electrodes. By proposing a novel atomic layer deposition (ALD) scheme, we overcome the challenge of oxidation of the lower Mo electrode; a 2 nm HZO deposited by thermally enhanced ALD followed by a 3 nm HZO deposited by plasma enhanced ALD. The fabricated sample demonstrated a 2Pr value of 38.5 μC/cm\n<sup>2</sup>\n at an operating voltage of 2 V. Furthermore, in endurance testing, the sample maintained a 2Pr value of 36.9 μC/cm\n<sup>2</sup>\n even after 10\n<sup>10</sup>\n cycles (△2Pr/2Pr\n<sub>pristine</sub>\n ≈ 7% from pristine to 10\n<sup>10</sup>\n cycles). With a maximum process temperature of 400 °C, our approach thereby meets the stringent requirement of Back-End-of-Line (BEOL) integration.","PeriodicalId":449,"journal":{"name":"IEEE Transactions on Nanotechnology","volume":"23 ","pages":"474-477"},"PeriodicalIF":2.1000,"publicationDate":"2024-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Nanotechnology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10543058/","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

In this letter, we have successfully fabricated a metal-ferroelectricity-metal (MFM) capacitor of an ultrathin 5 nm HZO utilizing Molybdenum (Mo) as the electrodes. By proposing a novel atomic layer deposition (ALD) scheme, we overcome the challenge of oxidation of the lower Mo electrode; a 2 nm HZO deposited by thermally enhanced ALD followed by a 3 nm HZO deposited by plasma enhanced ALD. The fabricated sample demonstrated a 2Pr value of 38.5 μC/cm 2 at an operating voltage of 2 V. Furthermore, in endurance testing, the sample maintained a 2Pr value of 36.9 μC/cm 2 even after 10 10 cycles (△2Pr/2Pr pristine ≈ 7% from pristine to 10 10 cycles). With a maximum process temperature of 400 °C, our approach thereby meets the stringent requirement of Back-End-of-Line (BEOL) integration.
与 BEOL 兼容的 5 nm 超薄 HZO 铁电电容器,具有高剩磁极化和出色的耐久性
在这封信中,我们利用钼(Mo)作为电极,成功地制造出了超薄 5 nm HZO 金属铁电(MFM)电容器。通过提出一种新颖的原子层沉积(ALD)方案,我们克服了下层钼电极氧化的难题;通过热增强 ALD 沉积了 2 nm 的 HZO,然后通过等离子体增强 ALD 沉积了 3 nm 的 HZO。在工作电压为 2 V 时,制备的样品的 2Pr 值为 38.5 μC/cm2。此外,在耐久性测试中,样品在经过 1010 次循环后仍能保持 36.9 μC/cm2 的 2Pr 值(从原始到 1010 次循环的△2Pr/2Prpristine ≈ 7%)。我们的方法的最高工艺温度为 400 °C,因此符合生产线后端 (BEOL) 集成的严格要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
IEEE Transactions on Nanotechnology
IEEE Transactions on Nanotechnology 工程技术-材料科学:综合
CiteScore
4.80
自引率
8.30%
发文量
74
审稿时长
8.3 months
期刊介绍: The IEEE Transactions on Nanotechnology is devoted to the publication of manuscripts of archival value in the general area of nanotechnology, which is rapidly emerging as one of the fastest growing and most promising new technological developments for the next generation and beyond.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信