Effect of n-type Cl doping on electrical conductivity of few layer WS2

Arpita Roy, Santanu Sharma, Biplob Mondal
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Abstract

The work reported here focuses on improving the electrical conductivity of tungsten disulfide (WS2) nanosheets by n-type impurity doping. The WS2 is a 2D transition metal dichalcogenide material which possess desirable properties such as high mobility and bandgaps, making them potential candidates for future semiconductor device applications. However, the presence of sulfur vacancies in semiconductor and weak binding energy at the metal–semiconductor interface often results in a high Schottky barrier height (SBH) leading to poor electrical conductivity. To overcome this issue, the research focusses on investigating the reduction of SBH at the junction between WS2 and metal. The effect of time dependent chlorine (Cl) doping on the SBH of exfoliated WS2 was studied through I–V measurement at different temperatures. The results indicate SBH reduction from 0.75 eV for undoped to 0.65 eV for Cl doped samples. Overall, the study demonstrates that Cl doping can effectively decrease the Schottky barrier height of WS2 thin-film, leading to enhanced electrical transport properties. The mechanism involved in the modulation of electronic property of the system is also explained with the help of an energy band model. These findings contribute to the understanding and advancement of high-performance semiconductor devices established on the n-type doping of WS2 thin film.

Abstract Image

n 型 Cl 掺杂对少层 WS2 电导率的影响
本文报告的工作重点是通过掺杂 n 型杂质来提高二硫化钨(WS2)纳米片的导电性。WS2 是一种二维过渡金属二卤化物材料,具有高迁移率和带隙等理想特性,是未来半导体器件应用的潜在候选材料。然而,半导体中硫空位的存在和金属-半导体界面的弱结合能往往会导致肖特基势垒高度(SBH)过高,从而导致导电性能较差。为了克服这一问题,研究重点是研究如何降低 WS2 与金属交界处的 SBH。通过在不同温度下进行 I-V 测量,研究了氯 (Cl) 掺杂对剥离 WS2 的 SBH 的影响。结果表明,未掺杂样品的 SBH 值从 0.75 eV 降至掺杂 Cl 样品的 0.65 eV。总之,这项研究表明,掺入 Cl 能有效降低 WS2 薄膜的肖特基势垒高度,从而增强其电气传输特性。研究还借助能带模型解释了系统电子特性的调制机制。这些发现有助于理解和推进建立在 WS2 薄膜 n 型掺杂基础上的高性能半导体器件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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