{"title":"Modeling of Temperature Rises at Focal-Plane-Array and Their Impact on the Performance of a CCD-Based Spaceborne Earth-Observing Imaging System","authors":"Chahira Serief;Nassima Khorchef;Youcef Ghelamallah","doi":"10.1109/TDMR.2024.3390798","DOIUrl":null,"url":null,"abstract":"Space optical imaging systems are subject during their in-orbit lifetime to many damaging effects caused by aging and harsh conditions (temperature and radiation) in the low Earth orbit environment threatening consequently instruments’ performance and durability. In particular, the time-dependent increase of the detector’s thermally-induced dark current due to temperature rises at the Focal-Plane-Array (FPA) may well lead to an unacceptable degradation in the radiometric performance of the optical imager. The aim of this work is to establish measures for the mitigation of FPA thermal effects on the radiometric performance and calibration of a space-borne optical imaging payload through FPA design optimization and in-orbit operation of the optical imaging payload. The temperature rises at FPA during long strip acquisition are first modeled, and results are used to assess the consequent effect on radiometric performance by predicting time-variable changes in detector offset due to thermal leakage current. Then, based on the outcomes of the thermal model and offset signals calculation, recommendations regarding FPA design and the operation of the optical imaging payload are made to mitigate the effect of FPA temperature rises on the imager’s radiometric performance. Finally, in-flight FPA temperature measurements taken during on-orbit operation are compared with the FPA thermal model results. The modeling results exhibit a strong correspondence with the measurements acquired during the flight. The dark current derived from in-flight data demonstrates that the time-dependent increase in the detector offset signals induced by temperature rises at FPA during image acquisition is negligible, validating the proposed thermal mitigation strategy.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"24 2","pages":"335-343"},"PeriodicalIF":2.5000,"publicationDate":"2024-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10504872/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Space optical imaging systems are subject during their in-orbit lifetime to many damaging effects caused by aging and harsh conditions (temperature and radiation) in the low Earth orbit environment threatening consequently instruments’ performance and durability. In particular, the time-dependent increase of the detector’s thermally-induced dark current due to temperature rises at the Focal-Plane-Array (FPA) may well lead to an unacceptable degradation in the radiometric performance of the optical imager. The aim of this work is to establish measures for the mitigation of FPA thermal effects on the radiometric performance and calibration of a space-borne optical imaging payload through FPA design optimization and in-orbit operation of the optical imaging payload. The temperature rises at FPA during long strip acquisition are first modeled, and results are used to assess the consequent effect on radiometric performance by predicting time-variable changes in detector offset due to thermal leakage current. Then, based on the outcomes of the thermal model and offset signals calculation, recommendations regarding FPA design and the operation of the optical imaging payload are made to mitigate the effect of FPA temperature rises on the imager’s radiometric performance. Finally, in-flight FPA temperature measurements taken during on-orbit operation are compared with the FPA thermal model results. The modeling results exhibit a strong correspondence with the measurements acquired during the flight. The dark current derived from in-flight data demonstrates that the time-dependent increase in the detector offset signals induced by temperature rises at FPA during image acquisition is negligible, validating the proposed thermal mitigation strategy.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.