Sara Vecchi;Andrea Padovani;Paolo Pavan;Francesco Maria Puglisi
{"title":"From Accelerated to Operating Conditions: How Trapped Charge Impacts on TDDB in SiO₂ and HfO₂ Stacks","authors":"Sara Vecchi;Andrea Padovani;Paolo Pavan;Francesco Maria Puglisi","doi":"10.1109/TDMR.2024.3384056","DOIUrl":null,"url":null,"abstract":"Despite the various well-established theories such as the thermochemical (E-model), \n<inline-formula> <tex-math>$\\surd $ </tex-math></inline-formula>\n E-model, power law \n<inline-formula> <tex-math>$(V^{N}$ </tex-math></inline-formula>\n-model), and 1/E-model, accurately replicate dielectric breakdown (BD) experimental trends in accelerated conditions, they diverge significantly in lifetime estimations when projecting to operating conditions. The recently introduced Carrier Injection (CI) model successfully reconciles the discrepancies observed in the aforementioned theories within a unified framework, revealing that the time-dependent dielectric breakdown (TDDB) E-field dependence can change from thermochemical to power-law, and even to 1/E trend, depending on the microscopic properties of key atomic species (precursors). Notably, these findings were based on the assumption that the electric field in the dielectric is solely influenced by the applied bias, disregarding the impact of trapped charge at defects and precursors. Nevertheless, it is recognized that trapped charge significantly contributes to the local electric field within the oxide at low applied voltages, leading to a substantial difference between accelerated and operating conditions. With that in mind, this paper incorporates the influence of trapped charges into the CI model, offering a more complete explanation of the BD phenomenon in SiO2 and HfO2 stacks. The research demonstrates that, depending on the material system and the nature of defect precursors in the oxide, the presence of trapped charge can result in significant deviations from TDDB lifetime predictions derived from conventional models. Furthermore, the study explores the combined impact of trapped charge and the microscopic properties of defect precursor sites on TDDB and leakage current through the oxide.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"24 2","pages":"194-202"},"PeriodicalIF":2.5000,"publicationDate":"2024-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10488086/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Despite the various well-established theories such as the thermochemical (E-model),
$\surd $
E-model, power law
$(V^{N}$
-model), and 1/E-model, accurately replicate dielectric breakdown (BD) experimental trends in accelerated conditions, they diverge significantly in lifetime estimations when projecting to operating conditions. The recently introduced Carrier Injection (CI) model successfully reconciles the discrepancies observed in the aforementioned theories within a unified framework, revealing that the time-dependent dielectric breakdown (TDDB) E-field dependence can change from thermochemical to power-law, and even to 1/E trend, depending on the microscopic properties of key atomic species (precursors). Notably, these findings were based on the assumption that the electric field in the dielectric is solely influenced by the applied bias, disregarding the impact of trapped charge at defects and precursors. Nevertheless, it is recognized that trapped charge significantly contributes to the local electric field within the oxide at low applied voltages, leading to a substantial difference between accelerated and operating conditions. With that in mind, this paper incorporates the influence of trapped charges into the CI model, offering a more complete explanation of the BD phenomenon in SiO2 and HfO2 stacks. The research demonstrates that, depending on the material system and the nature of defect precursors in the oxide, the presence of trapped charge can result in significant deviations from TDDB lifetime predictions derived from conventional models. Furthermore, the study explores the combined impact of trapped charge and the microscopic properties of defect precursor sites on TDDB and leakage current through the oxide.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.