Tailoring the strengthening mechanisms of high-entropy alloys toward excellent strength-ductility synergy by metalloid silicon alloying: A review

IF 33.6 1区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Mohammad Javad Sohrabi , Alireza Kalhor , Hamed Mirzadeh , Kinga Rodak , Hyoung Seop Kim
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引用次数: 0

Abstract

Metalloids and transition/refractory elements typically differ significantly in the electronic structure and atomic size, allowing for stronger solid-solution hardening in high-entropy alloys (HEAs) as well as improved work-hardening capability, which leads to exceptional strength-ductility balance. In this regard, Si addition has opened up a new pathway for developing novel and high-performance Cantor-based, lightweight, and refractory HEAs, which has recently attracted considerable attention from the materials science community. Accordingly, the present review paper summarizes the recent progress in tailoring the mechanical properties and strengthening mechanisms of Si-added HEAs. After reviewing the general strengthening mechanisms of HEAs, the impact of Si addition is critically discussed, especially its effects on the (I) solid-solution hardening by local lattice distortion and chemical short-range order (SRO) hardening, (II) second-phase strengthening by promoting the formation of disordered solid-solution phases, silicides, σ-phase, and other intermetallics, (III) structural refinement and facilitating the development of heterostructures, and (IV) work-hardening behavior by altering the dislocation arrangements, boosting the twinning-induced plasticity (TWIP) effect as well as HCP and BCC transformation-induced plasticity (TRIP) effect by reduced and variable stacking fault energy (SFE). Finally, the research gaps and future prospects are introduced, including metastability engineering, superplasticity, application of severe plastic deformation (SPD) techniques for grain refinement, and additive manufacturing.

通过金属硅合金化调整高熵合金的强化机制,实现优异的强度-电导率协同作用:综述
金属元素和过渡/难熔元素通常在电子结构和原子尺寸上存在显著差异,这使得高熵合金(HEAs)具有更强的固溶硬化能力和更好的加工硬化能力,从而实现优异的强度-电导率平衡。在这方面,添加硅为开发新型、高性能、轻质和难熔的康托尔基高熵合金开辟了一条新途径,最近引起了材料科学界的广泛关注。因此,本综述论文总结了在定制加硅 HEA 的机械性能和强化机制方面的最新进展。在回顾了 HEAs 的一般强化机理之后,本文对添加 Si 的影响进行了深入探讨,尤其是其对以下方面的影响:(I)通过局部晶格畸变和化学短程有序硬化(SRO)实现固溶硬化;(II)通过促进无序固溶相、硅化物、σ相和其他金属间化合物的形成实现第二相强化;(III)通过促进无序固溶相、硅化物、σ相和其他金属间化合物的形成实现第二相强化;(IV)通过促进无序固溶相、硅化物、σ相和其他金属间化合物的形成实现第二相强化、(IV) 通过改变位错排列,提高孪晶诱导塑性(TWIP)效应以及 HCP 和 BCC 转变诱导塑性(TRIP)效应,降低和改变堆叠断层能(SFE),实现加工硬化行为。最后,介绍了研究空白和未来展望,包括陨变工程、超塑性、应用剧烈塑性变形 (SPD) 技术细化晶粒和增材制造。
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来源期刊
Progress in Materials Science
Progress in Materials Science 工程技术-材料科学:综合
CiteScore
59.60
自引率
0.80%
发文量
101
审稿时长
11.4 months
期刊介绍: Progress in Materials Science is a journal that publishes authoritative and critical reviews of recent advances in the science of materials. The focus of the journal is on the fundamental aspects of materials science, particularly those concerning microstructure and nanostructure and their relationship to properties. Emphasis is also placed on the thermodynamics, kinetics, mechanisms, and modeling of processes within materials, as well as the understanding of material properties in engineering and other applications. The journal welcomes reviews from authors who are active leaders in the field of materials science and have a strong scientific track record. Materials of interest include metallic, ceramic, polymeric, biological, medical, and composite materials in all forms. Manuscripts submitted to Progress in Materials Science are generally longer than those found in other research journals. While the focus is on invited reviews, interested authors may submit a proposal for consideration. Non-invited manuscripts are required to be preceded by the submission of a proposal. Authors publishing in Progress in Materials Science have the option to publish their research via subscription or open access. Open access publication requires the author or research funder to meet a publication fee (APC). Abstracting and indexing services for Progress in Materials Science include Current Contents, Science Citation Index Expanded, Materials Science Citation Index, Chemical Abstracts, Engineering Index, INSPEC, and Scopus.
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