Experts in the Loop: Conditional Variable Selection Based on Deep Learning for Accelerating Post-Silicon Validation

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yiwen Liao;Raphaël Latty;Bin Yang
{"title":"Experts in the Loop: Conditional Variable Selection Based on Deep Learning for Accelerating Post-Silicon Validation","authors":"Yiwen Liao;Raphaël Latty;Bin Yang","doi":"10.1109/TSM.2024.3373690","DOIUrl":null,"url":null,"abstract":"Post-silicon validation is one of the most critical processes in modern semiconductor manufacturing. Specifically, correct and deep understanding in test cases of manufactured devices is key to enable post-silicon tuning and debugging. This analysis is typically performed by experienced human experts. However, with the fast development in semiconductor industry, test cases can contain hundreds of variables. The resulting high-dimensionality poses enormous challenges to experts. Thereby, some recent prior works have introduced data-driven variable selection algorithms to tackle these problems and achieved notable success. Nevertheless, for these methods, experts are not involved in training and inference phases, which may lead to bias and inaccuracy due to the lack of prior knowledge. Hence, this letter for the first time aims to design a novel conditional variable selection approach while keeping experts in the loop. In this way, we expect that our algorithm can be more efficiently and effectively trained to identify the most critical variables under certain expert knowledge. Extensive experiments on both synthetic and real-world datasets from industry have been conducted and shown the effectiveness of our method.","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 2","pages":"199-206"},"PeriodicalIF":2.3000,"publicationDate":"2024-03-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Semiconductor Manufacturing","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10461130/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

Post-silicon validation is one of the most critical processes in modern semiconductor manufacturing. Specifically, correct and deep understanding in test cases of manufactured devices is key to enable post-silicon tuning and debugging. This analysis is typically performed by experienced human experts. However, with the fast development in semiconductor industry, test cases can contain hundreds of variables. The resulting high-dimensionality poses enormous challenges to experts. Thereby, some recent prior works have introduced data-driven variable selection algorithms to tackle these problems and achieved notable success. Nevertheless, for these methods, experts are not involved in training and inference phases, which may lead to bias and inaccuracy due to the lack of prior knowledge. Hence, this letter for the first time aims to design a novel conditional variable selection approach while keeping experts in the loop. In this way, we expect that our algorithm can be more efficiently and effectively trained to identify the most critical variables under certain expert knowledge. Extensive experiments on both synthetic and real-world datasets from industry have been conducted and shown the effectiveness of our method.
循环中的专家:基于深度学习的条件变量选择,加速硅后验证
硅后验证是现代半导体制造中最关键的流程之一。具体来说,正确深入地了解制造设备的测试案例是实现硅后调整和调试的关键。这种分析通常由经验丰富的人类专家执行。然而,随着半导体行业的快速发展,测试用例可能包含数百个变量。由此产生的高维度给专家带来了巨大的挑战。因此,最近的一些工作引入了数据驱动的变量选择算法来解决这些问题,并取得了显著的成功。然而,对于这些方法来说,专家并不参与训练和推理阶段,这可能会因为缺乏先验知识而导致偏差和不准确。因此,这封信首次旨在设计一种新颖的条件变量选择方法,同时让专家参与其中。通过这种方法,我们希望我们的算法能更高效、更有效地进行训练,以在一定的专家知识下识别出最关键的变量。我们在合成数据集和实际工业数据集上进行了广泛的实验,证明了我们方法的有效性。
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来源期刊
IEEE Transactions on Semiconductor Manufacturing
IEEE Transactions on Semiconductor Manufacturing 工程技术-工程:电子与电气
CiteScore
5.20
自引率
11.10%
发文量
101
审稿时长
3.3 months
期刊介绍: The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.
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