Development and Performance Evolution of Medium-Pressure He/SF6/O2-Based Plasma and Wet Chemical Etching Process for Surface Modification of Fused Silica
{"title":"Development and Performance Evolution of Medium-Pressure He/SF6/O2-Based Plasma and Wet Chemical Etching Process for Surface Modification of Fused Silica","authors":"Hari Narayan Singh Yadav, Manas Das","doi":"10.1007/s11090-024-10447-x","DOIUrl":null,"url":null,"abstract":"<div><p>The rising demand for precision optics widely employed in ground and space-based astronomical instruments and other scientific instrumentation requires highly efficient advanced fabrication methods. Due to complex-shaped fused silica substrate surfaces like freeform or aspheres with strong curvatures or very small-sized components, a novel non-contact medium-pressure plasma-based method is developed to finish optical components. The present study critically compares the polished optical surfaces of a prism with a medium-pressure plasma process and wet chemical etching to provide insight into their smoothing. The results show that surface roughness (<i>R</i><sub><i>a</i></sub>) increases from 0.54 to 2.61 nm and 0.53 to 0.57 nm at 5 and 20 mbar total pressures, respectively, using a plasma process without surface contamination. However, wet chemical etching increases surface roughness (<i>R</i><sub><i>a</i></sub>) from 0.52 to 15.9 nm. The substrates' surface morphology, elemental composition, and surface topography are analyzed using FESEM, EDX, and AFM. Moreover, subsurface improvements are analyzed using Raman spectroscopy analysis.</p></div>","PeriodicalId":734,"journal":{"name":"Plasma Chemistry and Plasma Processing","volume":null,"pages":null},"PeriodicalIF":2.6000,"publicationDate":"2024-02-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Plasma Chemistry and Plasma Processing","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s11090-024-10447-x","RegionNum":3,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, CHEMICAL","Score":null,"Total":0}
引用次数: 0
Abstract
The rising demand for precision optics widely employed in ground and space-based astronomical instruments and other scientific instrumentation requires highly efficient advanced fabrication methods. Due to complex-shaped fused silica substrate surfaces like freeform or aspheres with strong curvatures or very small-sized components, a novel non-contact medium-pressure plasma-based method is developed to finish optical components. The present study critically compares the polished optical surfaces of a prism with a medium-pressure plasma process and wet chemical etching to provide insight into their smoothing. The results show that surface roughness (Ra) increases from 0.54 to 2.61 nm and 0.53 to 0.57 nm at 5 and 20 mbar total pressures, respectively, using a plasma process without surface contamination. However, wet chemical etching increases surface roughness (Ra) from 0.52 to 15.9 nm. The substrates' surface morphology, elemental composition, and surface topography are analyzed using FESEM, EDX, and AFM. Moreover, subsurface improvements are analyzed using Raman spectroscopy analysis.
期刊介绍:
Publishing original papers on fundamental and applied research in plasma chemistry and plasma processing, the scope of this journal includes processing plasmas ranging from non-thermal plasmas to thermal plasmas, and fundamental plasma studies as well as studies of specific plasma applications. Such applications include but are not limited to plasma catalysis, environmental processing including treatment of liquids and gases, biological applications of plasmas including plasma medicine and agriculture, surface modification and deposition, powder and nanostructure synthesis, energy applications including plasma combustion and reforming, resource recovery, coupling of plasmas and electrochemistry, and plasma etching. Studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces are also solicited. It is essential that submissions include substantial consideration of the role of the plasma, for example, the relevant plasma chemistry, plasma physics or plasma–surface interactions; manuscripts that consider solely the properties of materials or substances processed using a plasma are not within the journal’s scope.