Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applications

IF 1.7 4区材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Soldering & Surface Mount Technology Pub Date : 2024-02-09 DOI:10.1108/ssmt-08-2023-0052

Rizk Mostafa Shalaby, Mohamed Saad

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引用次数: 0

Abstract

Purpose

The purpose of the present work is to study the impacts of rapid cooling and Tb rare-earth additions on the structural, thermal and mechanical behavior of Bi–0.5Ag lead-free solder for high-temperature applications.

Design/methodology/approach

Effect of rapid solidification processing on structural, thermal and mechanical properties of Bi-Ag lead-free solder reinforced Tb rare-earth element.

Findings

The obtained results indicated that the microstructure consists of rhombohedral Bi-rich phase and Ag99.5Bi0.5 intermetallic compound (IMC). The addition of Tb could effectively reduce the onset and melting point. The elastic modulus of Tb-containing solders was enhanced to about 90% at 0.5 Tb. The higher elastic modulus may be attributed to solid solution strengthening effect, solubility extension, microstructure refinement and precipitation hardening of uniform distribution Ag99.5Bi0.5 IMC particles which can reasonably modify the microstructure, as well as inhibit the segregation and hinder the motion of dislocations.

Originality/value

It is recommended that the lead-free Bi-0.5Ag-0.5Tb solder be a candidate instead of common solder alloy (Sn-37Pb) for high temperature and high performance applications.

查看原文本刊更多论文

用于高性能应用的快速凝固型 Bi-0.5Ag 无铅焊料的结构、热和机械特性--强化锑稀土元素

本研究的目的是研究快速冷却和添加 Tb 稀土元素对高温应用 Bi-0.5Ag 无铅焊料的结构、热性能和机械性能的影响。研究结果表明，微观结构由斜方体富 Bi- 相和 Ag99.5Bi0.5 金属间化合物 (IMC) 组成。添加铽元素可有效降低起始点和熔点。0.5 Tb 时，含 Tb 焊料的弹性模量提高了约 90%。较高的弹性模量可能归因于均匀分布的 Ag99.5Bi0.5 IMC 粒子的固溶强化效应、溶解度扩展、微观结构细化和沉淀硬化，它们可以合理地改变微观结构，并抑制偏析和阻碍位错运动。

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来源期刊

Soldering & Surface Mount Technology 工程技术-材料科学：综合

CiteScore

4.10

自引率

15.00%

发文量

审稿时长

>12 weeks

期刊介绍： Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.