Medium Pressure Plasma Processing of Fused Silica: A Comparative Study for Material Removal Rate

IF 2.6 3区物理与天体物理 Q3 ENGINEERING, CHEMICAL

Plasma Chemistry and Plasma Processing Pub Date : 2024-01-03 DOI:10.1007/s11090-023-10440-w

Enni Krishna, K. Sreelakshmy, D. Sam Dayala Dev, Manas Das

引用次数: 0

Abstract

The use of fused silica material is crucial in various scientific applications; however, its chemical inertness and brittle nature pose challenges to machining and fabrication processes. The present study introduced a dynamic plasma flow system for medium-pressure plasma processing of fused silica substrate to address this issue. The results indicate that the new plasma flow system can significantly enhance the material removal rate compared to existing systems, with a 300% increase in material removal rate. Importantly, this process enables a sustained linear material removal rate, essential for long process durations. Despite the higher material removal rate, there is no deterioration in surface finish observed, and in fact, an improvement in surface integrity is noted after plasma processing. Confocal Raman microscopy characterization further confirms this improvement, revealing reduced stress-induced defect peaks compared to a confined plasma system.

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熔融石英的中压等离子处理：材料去除率比较研究

摘要在各种科学应用中，熔融石英材料的使用至关重要；然而，其化学惰性和脆性给加工和制造工艺带来了挑战。本研究引入了一种动态等离子体流系统，用于熔融石英基材的中压等离子体加工，以解决这一问题。结果表明，与现有系统相比，新的等离子流系统能显著提高材料去除率，材料去除率提高了 300%。重要的是，这种工艺能够实现持续的线性材料去除率，这对长时间的工艺过程至关重要。尽管材料去除率提高了，但表面光洁度却没有下降，事实上，等离子加工后表面完整性得到了改善。共焦拉曼显微镜表征进一步证实了这一改进，显示与封闭等离子系统相比，应力引起的缺陷峰有所减少。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Plasma Chemistry and Plasma Processing 工程技术-工程：化工

CiteScore

5.90

自引率

8.30%

发文量

审稿时长

6-12 weeks

期刊介绍： Publishing original papers on fundamental and applied research in plasma chemistry and plasma processing, the scope of this journal includes processing plasmas ranging from non-thermal plasmas to thermal plasmas, and fundamental plasma studies as well as studies of specific plasma applications. Such applications include but are not limited to plasma catalysis, environmental processing including treatment of liquids and gases, biological applications of plasmas including plasma medicine and agriculture, surface modification and deposition, powder and nanostructure synthesis, energy applications including plasma combustion and reforming, resource recovery, coupling of plasmas and electrochemistry, and plasma etching. Studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces are also solicited. It is essential that submissions include substantial consideration of the role of the plasma, for example, the relevant plasma chemistry, plasma physics or plasma–surface interactions; manuscripts that consider solely the properties of materials or substances processed using a plasma are not within the journal’s scope.