Nick Zhang;Young Suk Kim;Peter Hsu;Samsoo Kim;Derek Tao;Hung-Jen Liao;P. W. Wang;Geoffrey Yeap;Quincy Li;Tsung-Yung Jonathan Chang
{"title":"A 4.24-GHz 128×256 SRAM Operating Double Pump Read Write Same Cycle in 5-nm Technology","authors":"Nick Zhang;Young Suk Kim;Peter Hsu;Samsoo Kim;Derek Tao;Hung-Jen Liao;P. W. Wang;Geoffrey Yeap;Quincy Li;Tsung-Yung Jonathan Chang","doi":"10.1109/LSSC.2023.3336773","DOIUrl":null,"url":null,"abstract":"A High-Speed High-Density 1R1W two port 32Kbit (\n<inline-formula> <tex-math>$128\\times 256$ </tex-math></inline-formula>\n) SRAM with single port 6T bitcell macro is proposed. A read-then-write (RTW) double pump CLK generation circuit with tracking bitline (TRKBL) bypassing is proposed to boost read and write performance. A local interlock circuit (LIC) is introduced in Sense-Amp to reduce active power and push Fmax further. To mitigate metal RC degradation, double metal scheme is applied to improve signal integrity and enhance overall operating cycle time. The silicon results show that the slow corner wafer was able to achieve 4.24 GHz at 1.0 V/100 °C in 5-nm FinFET technology.","PeriodicalId":13032,"journal":{"name":"IEEE Solid-State Circuits Letters","volume":"7 ","pages":"6-9"},"PeriodicalIF":2.2000,"publicationDate":"2023-11-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Solid-State Circuits Letters","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/10328755/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
A High-Speed High-Density 1R1W two port 32Kbit (
$128\times 256$
) SRAM with single port 6T bitcell macro is proposed. A read-then-write (RTW) double pump CLK generation circuit with tracking bitline (TRKBL) bypassing is proposed to boost read and write performance. A local interlock circuit (LIC) is introduced in Sense-Amp to reduce active power and push Fmax further. To mitigate metal RC degradation, double metal scheme is applied to improve signal integrity and enhance overall operating cycle time. The silicon results show that the slow corner wafer was able to achieve 4.24 GHz at 1.0 V/100 °C in 5-nm FinFET technology.