The 2023 Networks-on-Chip (NOCS) Symposium

IF 1.9 4区工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE

IEEE Design & Test Pub Date : 2023-10-20 DOI:10.1109/mdat.2023.3316128

Partha Pratim Pande

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引用次数: 0

Abstract

The highlight of this issue is the journal-first model adopted for the articles accepted in the 17th edition of the Networks-on-Chip (NOCS) Symposium. NOCS is held in conjunction with the Embedded Systems Week (ESWEEK). This year, NOCS was held in Hamburg, Germany, on 21–22 September 2023, marking its return to a fully in-person symposium after virtual and hybrid editions during the pandemic. NOCS is the premier event dedicated to interdisciplinary research on on-chip, package-scale, chip-to-chip, and datacenter rack-scale communication technology as well as architectures, design methods, applications, and systems. NOCS brings together scientists and engineers working on NoC innovations and applications from interdisciplinary research communities and areas, including discrete optimization and algorithms, computer architecture, networking, circuits and systems, packaging, embedded systems, and design automation. We thank the Technical Program Chairs of NOCS 2023, Masoumeh (Azin) Ebrahimi and Sujay Deb, along with the General Chairs Mahdi Nikdast and Miquel Moreto, for the timely delivery of all the accepted NOCS papers to the IEEE Design&Test submission system for further processing. This special issue consists of 15 papers.

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2023片上网络(NOCS)研讨会

本刊的亮点是第17届网络芯片(NOCS)研讨会上的文章采用了期刊优先模式。NOCS与嵌入式系统周(ESWEEK)同时举行。今年，NOCS于2023年9月21日至22日在德国汉堡举行，标志着继大流行期间的虚拟和混合版本之后，它又回到了完全面对面的研讨会。NOCS是致力于片上、封装级、片对片和数据中心机架级通信技术以及架构、设计方法、应用和系统的跨学科研究的首要活动。NOCS汇集了来自跨学科研究社区和领域的科学家和工程师，他们致力于NoC的创新和应用，包括离散优化和算法、计算机体系结构、网络、电路和系统、封装、嵌入式系统和设计自动化。我们感谢NOCS 2023技术项目主席Masoumeh (Azin) Ebrahimi和Sujay Deb，以及总主席Mahdi Nikdast和Miquel Moreto及时将所有已接受的NOCS论文发送到IEEE设计与测试提交系统进行进一步处理。本期特刊由15篇论文组成。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Design & Test COMPUTER SCIENCE, HARDWARE & ARCHITECTURE-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

3.80

自引率

5.00%

发文量

期刊介绍： IEEE Design & Test offers original works describing the models, methods, and tools used to design and test microelectronic systems from devices and circuits to complete systems-on-chip and embedded software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. The magazine seeks to bring to its readers not only important technology advances but also technology leaders, their perspectives through its columns, interviews, and roundtable discussions. Topics include semiconductor IC design, semiconductor intellectual property blocks, design, verification and test technology, design for manufacturing and yield, embedded software and systems, low-power and energy-efficient design, electronic design automation tools, practical technology, and standards.