Gas-Delivery Fluid-Mechanical Timescales in Semiconductor Manufacturing

Abstract

Semiconductor manufacturing demands a fast delivery of multiple gases to the tool. Hence this document provides formulas for the fluid-mechanical timescales of this delivery. This is done with a simple but realistic model of a gas-supply system, together with theory and computational-fluid-dynamic (CFD) simulations, and for representative but not comprehensive conditions relevant to etch. This timescale analysis shows that the rate-limiting process is (i) convection in the MFC-manifold tubing or (ii) convection in the tube between the flow splitter and the process chamber. This depends on (a) the lowest MFC sccm in the gas-supply system and (b) the total gas-supply-system sccm. Therefore, speeding up the gas delivery requires enhancing (i) and (ii). Moreover, (i) would become more important in view of a current trend towards smaller MFC sccms in etch. Examples on how to speed up the gas delivery and enhance the mixing are provided. The present analysis can be adapted to other conditions and manufacturing processes.