The 3D stack in short form (memory chip packaging)

Abstract

A novel form of 3D high-density stack, called a short stack, has been built and tested. One version of the short stack allowed accurate measurement of the T-connect resistance, approximately=0.025 ohms, while a second version was designed to provide four memory chips stacked for use in a low headroom application that incorporated the 3D technology with the high-density interconnect multichip approach.<>