High resolution 3D X-ray microscopy for streamlined failure analysis workflow

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2016-07-18 DOI:10.1109/IPFA.2016.7564285

C. Y. Liu, P. S. Kuo, C. Chu, A. Gu, J. Yoon

引用次数: 9

Abstract

High resolution 3D X-ray microscopy is a powerful non-destructive technology to inspect internal failure of IC packages. Here we present a correlative workflow by combining thermal emission microscopy, high resolution 3D X-ray microscopy and dual-beam focused ion beam microscopy to analyze a failed FCBGA package.

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用于简化故障分析工作流程的高分辨率3D x射线显微镜

高分辨率三维x射线显微镜是一种检测IC封装内部故障的强大的非破坏性技术。本文采用热发射显微镜、高分辨率三维x射线显微镜和双光束聚焦离子束显微镜相结合的方法对失效的FCBGA封装进行了分析。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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