The effects of materials and post-mold profiles an plastic encapsulated integrated circuits

Abstract

Post-mold cure contributes to the electrical and mechanical properties of Novalac molding materials and affects how those properties change with thermal and humidity environments. Forward biased parasitic gates may be created as the result of thermally induced material changes in conjunction with ionizing fields and by molding compound delamination from the die surface during high temperature assembly operations e.g., IR-reflow. Molding material conductivity and tolerance to moisture depends upon the material and the post-mold cure environment. Test methods have been developed and equipment is available to quantify compound electrical and mechanical performance and thereby predict material and part performance.<>