Solid Liquid Inter-Diffusion bonding at low temperature

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2014-07-15 DOI:10.1109/LTB-3D.2014.6886198

J. Froemel, M. Baum, M. Wiemer, T. Gessner

引用次数: 2

Abstract

Solid Liquid Inter-Diffusion (SLID) bonding using the systems Cu/Ga and Au/In have been investigated regarding the bonding parameters and their influence on shear strength. Especially temperature dependence and composition of interface have been focused on.

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低温固液间扩散键合

研究了Cu/Ga和Au/In两种体系的固液间扩散键合工艺参数及其对剪切强度的影响。重点研究了温度依赖性和界面组成。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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