Inkjet-printed system-on-paper/polymer “green” RFID and wireless sensors

M. Tentzeris, R. Vyas, V. Lakafosis, A. Traille, A. Rida, G. Shaker
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引用次数: 3

Abstract

In this talk, inkjet-printed flexible antennas, RF electronics and sensors fabricated on paper and other polymer (e.g. LCP) substrates are introduced as a system-level solution for ultra-low-cost mass production of UHF Radio Frequency Identification (RFID) Tags and Wireless Sensor Nodes (WSN) in an approach that could be easily extended to other microwave and wireless applications. A compact inkjet-printed UHF “passive-RFID” antenna using the classic T-match approach and designed to match IC's complex impedance, is presented as a demonstrating prototype for this technology. In addition, the authors briefly touch up the state-of-the-art area of fully-integrated wireless sensor modules on paper and show the first ever 2D sensor integration with an RFID tag module on paper, as well as the possibility of a 3D multilayer paper-based RF/microwave structures, that could potentially set the foundation for the truly convergent wireless sensor ad-hoc networks of the future. Plus, the authors present benchmarking results for various scavenging approaches involving RF, kinetic and thermal energy. Various challenges of packaging, passives, antennas, sensors and power sources integration are investigated in terms of ruggedness, reliability and flexing performance for space, automotive, "smart-skin" and wearable applications. This is the first time a complete 3D "green" system-on-paper including vertical interconnects and silver epoxy for the attachment of IC's will be presented for operability in frequencies in excess of 900 MHz.
喷墨打印纸上系统/聚合物“绿色”RFID和无线传感器
在本次演讲中,我们介绍了在纸和其他聚合物(如LCP)基板上制造的喷墨打印柔性天线、射频电子设备和传感器,作为超高频射频识别(RFID)标签和无线传感器节点(WSN)的超低成本批量生产的系统级解决方案,这种方法可以很容易地扩展到其他微波和无线应用。采用经典T-match方法的小型喷墨打印UHF“无源rfid”天线,设计用于匹配IC的复杂阻抗,作为该技术的演示原型。此外,作者还简要介绍了纸上完全集成无线传感器模块的最新领域,并展示了有史以来第一个与RFID标签模块集成的二维传感器,以及基于三维多层纸的射频/微波结构的可能性,这可能为未来真正融合的无线传感器自组织网络奠定基础。此外,作者介绍了各种清除方法的基准测试结果,包括射频,动能和热能。在空间、汽车、“智能皮肤”和可穿戴应用方面,研究了封装、无源、天线、传感器和电源集成方面的各种挑战,包括坚固性、可靠性和柔性性能。这是第一次完整的3D“绿色”纸上系统,包括垂直互连和用于IC附件的银环氧树脂,可在超过900 MHz的频率下操作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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