Fabrication and properties of SiC/Cu composites for electronic packaging

Abstract

The 55vol.% SiC/sub p//Cu composites with different particle sizes were fabricated by squeeze casting technology for electronic packaging applications, also with the effect of particle size and annealing treatment on their thermo-physical and mechanical properties are discussed. The microstructure observation showed the composites were dense and uniform as well as void free. The CTEs of SiC/sub p//Cu composites decreased with the reducing of SiC particle sizes, and it could be further reduced by annealing treatment. As the particle size increased, the thermal conductivities of SiC/sub p//Cu composites increased, which was similar to that after annealing. The SiC/sub p//Cu composites exhibited high bending strength and elastic modulus at ambient temperature. After annealing, the bending strength of composites decreased slightly, and the elastic modulus kept unchanged.