Integrating EOP/EOFM as a Complimentary Localization Technique for Open Via/Contact

Abstract

The paper describes as integrated technique of Electro Optical Frequency Mapping (EOFM) and Electro Optical Probing (EOP) to localize open failure mode with traditional FA analysis approach. The technique was performed in analog devices on advanced SOI-based circuits. Two case studies were presented to demonstrate on how the newly introduced fault localization techniques work. These techniques can help to isolate or narrow down the suspected failing components.