III–V field effect transistors for future ultra-low power applications

G. Dewey, B. Chu-Kung, R. Kotlyar, M. Metz, N. Mukherjee, M. Radosavljevic
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引用次数: 50

Abstract

This paper summarizes the electrostatics and performance of III-V field effect transistors including thin body planar MOSFETs, 3-D tri-gate MOSFETs, and Tunneling FETs (TFETs). The electrostatics of the III-V devices is shown to improve from thick body planar to thin body planar and then to 3-D tri-gate. Beyond the MOSFET structures, sub-threshold slope (SS) steeper than 60 mV/decade has been demonstrated in III-V TFETs. These III-V devices, especially the 3-D tri-gate MOSFET and TFET, are viable options for future ultra low power applications.
未来超低功耗应用的III-V场效应晶体管
本文综述了III-V型场效应晶体管的静电和性能,包括薄体平面场效应管、三维三栅极场效应管和隧道场效应管(tfet)。从厚体平面到薄体平面,再到三维三栅极,III-V型器件的静电性能逐渐提高。除了MOSFET结构外,在III-V tfet中已证明亚阈值斜率(SS)大于60 mV/十十年。这些III-V器件,特别是3-D三栅极MOSFET和TFET,是未来超低功耗应用的可行选择。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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