3 Dimensional stacked pixel detector and sensor technology using less than 3-μmφ robust bump junctions

Abstract

This paper presents experimental results for a prototype pixel detector with 3.0-μmφ gold cone bumps fabricated by NpD (nanoparticle deposition) and Stacked CdTe/Si X-ray sensor TEG with gold cylindrical bumps fabricated by a low-incident-angle deposition method. The both bump resistances are less than 0.5ohm.