Heterogeneous integration by wafer-to-wafer transfer technology

Abstract

Laser-assisted selective die transfer for wafer-level integration and packaging between different sizes of dies was developed, and applied to a 2 GHz chip-size-packaged film bulk acoustic wave oscillator. Wafer-to-wafer thin film transfer by laser-assisted peeling and metal-metal bonding was developed and applied to a monolithic bandwidth tunable surface acoustic wave (SAW) filter for TV white space cognitive wireless LAN.