Development of a random-walk algorithm for IC-interconnect analysis: 2D TE benchmarks, materially homogeneous domains

K. Chatterjee, R. Iverson, Y. Le Coz
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Abstract

Fundamentally, the electrical properties of advanced multi-level IC interconnects must be described with Maxwell's equations. As an initial step towards developing an efficient methodology for electromagnetic analysis of IC interconnects, we have defined an entirely new numerical floating RW (Random-Walk) algorithm. The algorithm describes TE-mode (Transverse Electric) propagation within materially homogeneous 2D domains. The major difficulty of deriving simple, analytical surface Green's functions has been resolved by means of iterative perturbation theory. Square-domain insulator and conductor benchmark test problems yielded a mean absolute error of 0.004+0.0024i within a computed (normalized) solution range [0.0,1.0-0.3i]. Operation frequencies were 400 GHz and 1.0 GHz, for respective insulator and conductor problem sizes of 100 /spl mu/m and 10 /spl mu/m.
用于ic互连分析的随机漫步算法的发展:2D TE基准,材料均匀域
从根本上说,先进的多级集成电路互连的电学特性必须用麦克斯韦方程组来描述。作为开发有效的IC互连电磁分析方法的第一步,我们定义了一种全新的数值浮动RW(随机漫步)算法。该算法描述了te模式(横向电)在材料均匀的二维域中的传播。用迭代摄动理论解决了推导简单解析曲面格林函数的主要困难。方形域绝缘体和导体基准测试问题在计算(归一化)解决范围[0.0,1.0-0.3i]内产生的平均绝对误差为0.004+0.0024i。工作频率分别为400 GHz和1.0 GHz,绝缘体和导体问题尺寸分别为100 /spl mu/m和10 /spl mu/m。
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