Large format encapsulation

E. Kuah, J. Hao, Yuan Bin, W. Chan, Wu Kai, S. Ho
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引用次数: 5

Abstract

This paper will review the challenges on large format encapsulation with respect to mold cap thickness control, encapsulant impact on moldability such as flow mark and flow mark on final product. Control of mold co-planarity is best performed dynamically during molding, otherwise it would be challenging to obtain good co-planarity within ± 20 μm. Moldability demand such encapsulant coverage with highly viscous material, flow-ability and flow mark are discussed. Warpage control heavily depends on the formulation of the encapsulant and the form of encapsulant, i.e., granular, liquid and sheet.
大幅面封装
本文将回顾大幅面封装的挑战,包括模盖厚度控制,封装剂对可塑性的影响,如流动标记和最终产品的流动标记。模具共平面度的控制最好在成型过程中进行动态控制,否则在±20 μm范围内获得良好的共平面度将是一项挑战。讨论了高黏性材料覆盖、流动性和流标等模塑性要求。翘曲的控制很大程度上取决于封装剂的配方和封装剂的形式,即颗粒状、液体状和片状。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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