Fine pitch TSV integration in silicon micropin-fin heat sinks for 3D ICs

Abstract

Future high performance 3D systems require a systematic co-design of their electrical interconnect network and their heat removal mechanism. This paper presents fine pitch (20μm) and high aspect ratio (18:1) TSVs integrated in a micropin-fin heat sink capable of removing power density of 100W/cm2 and resulting in junction temperatures below 50°C.