Combined molding package (proximity sensor)

Abstract

Proximity sensors, which are designed to detect the presence of nearby objects without any physical contact. Proximity sensor basically employ an Infra Red LED transceiver and Light receiver to achieve proximity detection purpose. Existing proximity sensors comprise of 1 Infra red LED chip and 1 light receiver chip. This 2 separate chips setup has disadvantages of occupying more space and high assembly cost which does not meet the requirement for future application in smart phone and tablet PC Many current processes produce optical proximity sensors with poor optical isolation and unfavorable noise (e.g., light leakage) between the light emitter and light detector dies, among other poor performance characteristics. Furthermore, current molding processes utilize slow and inefficient human-operated manual casting methods that produce low and inconsistent manufacturing yields. This paper will present an innovative method of combining Infra red LED chip and receiver chip into 1 package with enhanced infra red shielding capability that keeping cross talk to extremely low level. The paper also elaborate importance of using FEA method in material selection and series of evaluation to accomplish development of combine molding package (patent filed by Carsem).