Modeling of the effect of heat flux on replication accuracy using roll-to-roll micro hot embossing

S. Chen, X. Shan, H. S. Ng, Zhaowei Zhong, B. M. Mohaime
{"title":"Modeling of the effect of heat flux on replication accuracy using roll-to-roll micro hot embossing","authors":"S. Chen, X. Shan, H. S. Ng, Zhaowei Zhong, B. M. Mohaime","doi":"10.1109/EPTC.2016.7861472","DOIUrl":null,"url":null,"abstract":"R2R large area fabrication of functional panels gained popularity in recent years and micro 3D profiles for optical films and biomedical applications have gained momentum with improving replication accuracies in hot embossing systems. However, studies on the effect of heat flux on the replication accuracy have been lacking. In this study, a twin belt based roll-to-roll embossing system was designed and built to study the effects of various in-situ heat transfer at the hot embossing nip. Seamless embossing was then demonstrated on PVC film. The effects of different heat transfer schemes have been modeled using Solidworks simulation applying experimentally obtained mechanical properties of the polymer film. The simulation results are compared quantitatively to the experimental results to analyze the effect of heat transfer schemes on the replication accuracies. We achieved 92% replication accuracies on the PVC film replicated by application of heat on the side of the film not in contact with the mold. It is significantly higher than the features replicated using an isothermal condition at Tg and also heat transfer from the mold. Thermal simulation shows a steep thermal gradient between the polymer under nip and the immediate surrounding for the isothermal conditions and a gentle thermal gradient for the other two schemes. Displacement of the polymer shows a highest flow of material from the surrounding of the feature for the underside heating method. This results in a more accurate replication onto the PVC film.","PeriodicalId":136525,"journal":{"name":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2016.7861472","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

R2R large area fabrication of functional panels gained popularity in recent years and micro 3D profiles for optical films and biomedical applications have gained momentum with improving replication accuracies in hot embossing systems. However, studies on the effect of heat flux on the replication accuracy have been lacking. In this study, a twin belt based roll-to-roll embossing system was designed and built to study the effects of various in-situ heat transfer at the hot embossing nip. Seamless embossing was then demonstrated on PVC film. The effects of different heat transfer schemes have been modeled using Solidworks simulation applying experimentally obtained mechanical properties of the polymer film. The simulation results are compared quantitatively to the experimental results to analyze the effect of heat transfer schemes on the replication accuracies. We achieved 92% replication accuracies on the PVC film replicated by application of heat on the side of the film not in contact with the mold. It is significantly higher than the features replicated using an isothermal condition at Tg and also heat transfer from the mold. Thermal simulation shows a steep thermal gradient between the polymer under nip and the immediate surrounding for the isothermal conditions and a gentle thermal gradient for the other two schemes. Displacement of the polymer shows a highest flow of material from the surrounding of the feature for the underside heating method. This results in a more accurate replication onto the PVC film.
热通量对卷对卷微热压印复制精度影响的建模
近年来,R2R大面积制造功能面板越来越受欢迎,用于光学薄膜和生物医学应用的微3D轮廓随着热压印系统中复制精度的提高而获得了动力。然而,关于热通量对复制精度影响的研究一直缺乏。在本研究中,设计并建立了一个基于双带的辊对辊压印系统,研究了热压印压痕处各种原位换热的影响。然后在PVC薄膜上演示了无缝压花。利用Solidworks仿真软件对不同传热方案的影响进行了模拟,并应用实验得到的聚合物膜的力学性能。将模拟结果与实验结果进行了定量比较,分析了不同换热方式对模拟精度的影响。我们在PVC膜上实现了92%的复制精度,通过在膜不与模具接触的一侧施加热量来复制。它明显高于在Tg等温条件下复制的特征,也高于从模具传热。热模拟表明,在等温条件下,夹紧聚合物与周围环境之间的热梯度较大,而在其他两种方案中,热梯度较小。聚合物的位移显示出最高的材料流从周围的特征为底面加热方法。这导致更准确地复制到PVC膜上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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