CMOS IC stuck-open-fault electrical effects and design considerations

J. Soden, R. Treece, Michael R. Taylor, C. Hawkins
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引用次数: 107

Abstract

The authors evaluate CMOS IC stuck-open-fault electrical effects, including voltage levels, quiescent power supply current (I/sub DDQ/), transient response, and important testing considerations. The transient responses of the defective node voltage and power supply current to the high-impedance state caused by a stuck-open defect were measured to determine if the I/sub DDQ/ measurement technique could detect stuck-open faults. The measured transient response of stuck-open faults shows that this defect acts as a memory fault for normal system and tester clock periods. The data also show that detectable elevated I/sub DDQ/ can occur rapidly for some circuit designs. Elevated I/sub DDQ/ can also occur over many clock cycles as the high-impedance node associated with the stuck-open fault undergoes a drift in its voltage. The I/sub DDQ/ technique is interpreted as significantly enhancing the detection of stuck-open defects, but not guaranteeing their detection. Modifications to the circuit layout to reduce the probability of stuck-open-fault occurrence are presented.<>
CMOS IC卡开故障的电效应及设计考虑
作者评估了CMOS IC卡开故障的电气效应,包括电压水平、静态电源电流(I/sub DDQ/)、瞬态响应和重要的测试考虑因素。通过测量缺陷节点电压和电源电流对卡开缺陷引起的高阻抗状态的瞬态响应,确定I/sub DDQ/测量技术是否能够检测卡开故障。对卡开故障的瞬态响应的测量表明,该缺陷在正常系统和测试仪时钟周期内起着存储器故障的作用。数据还表明,对于某些电路设计,可检测到的I/sub DDQ/升高可以迅速发生。升高的I/sub DDQ/也可能在多个时钟周期内发生,因为与卡开故障相关的高阻抗节点在其电压中经历了漂移。I/sub DDQ/技术被解释为显著提高了对卡开缺陷的检测,但不能保证它们的检测。对电路布局进行了修改,以降低卡开故障发生的概率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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