Surface smoothing of Au plated films by template stripping towards low-temperature bonding for 3D integration

L. Thu, T. Matsumae, Y. Kurashima, H. Takagi, E. Higurashi
{"title":"Surface smoothing of Au plated films by template stripping towards low-temperature bonding for 3D integration","authors":"L. Thu, T. Matsumae, Y. Kurashima, H. Takagi, E. Higurashi","doi":"10.1109/LTB-3D53950.2021.9598356","DOIUrl":null,"url":null,"abstract":"This study reports the smoothing of rough Au surfaces fabricated by electroless plating by multiple thin film transfer process based on the template stripping method. The formation of ultrasmooth Au with Ra surface roughness of less than 1.0 nm was obtained, which results in surfaces suitable for bonding of Au/Au at low temperature.","PeriodicalId":198318,"journal":{"name":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LTB-3D53950.2021.9598356","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

This study reports the smoothing of rough Au surfaces fabricated by electroless plating by multiple thin film transfer process based on the template stripping method. The formation of ultrasmooth Au with Ra surface roughness of less than 1.0 nm was obtained, which results in surfaces suitable for bonding of Au/Au at low temperature.
采用模板剥离法对镀金薄膜进行表面平滑,以实现三维集成的低温键合
本文报道了基于模板剥离法的多层薄膜转移工艺对化学镀金粗糙表面的平滑处理。制备出了表面粗糙度小于1.0 nm的超光滑Au,获得了适合Au/Au低温键合的表面。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信