Research on the Board-level Reliability of Ceramic Column Grid Array Packaging Component

Abstract

With the development of universe space exploration, the Ceramic column grid array (CCGA) package is widely used for its excellent performance for the field programmable gate array (FPGA) logic device. Generally, the board level reliability of this device is evaluated by ways of vibration following thermal cycling test in order to simulate the condition experienced by the spacecraft during launching and on-orbit operation stage. In this paper, a print circuit board (pcb) soldering a CCGA component with 1140 I/Os was designed and the thermal shock and vibration test were conducted. The test board comprises series of light emitting diodes (LEDs) which can be lighted up when downloading program into the CCGA component and that can reflect the reliability of solder joint or column. The results show that some LEDs were went out after thermal shock following vibration test and the failure was induced by the vibration rather than the thermal shock based on the other two boards test result. In addition, the Z direction vibration that parallel to the column was responsible for failure rather than the X and Y direction. On the other hand, the crack was found on columns near the rib stiffener and its distribution is disordered, some near the pcb side and other near the component side. At last, a board with new structure was designed and the same test was conducted. The electric property had no change before and after the thermal shock following vibration test and no crack was found from the cross section analysis which means the structure design has an important effect on the CCGA component vibration reliability.