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Apply to the package substrate of low low-CTE polyimide laminate sheet

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Pub Date : 2010-11-01 DOI:10.1109/IEMT.2010.5746736
Toshiyuki Tsuchiya, Takefumi Yoshida, M. Tsutsumi, S. Maeda, Y. Tsukada
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适用于低cte聚酰亚胺层压板的封装基板
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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来源期刊
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)
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