Smart power technologies enabling power SOC and SIP

Abstract

Today's smart power technologies and advanced packaging techniques have helped enable complex power systems on chip (SOCs) as well as multi-chip power modules and systems in package (SIPs). Innovations in power management SOCs and SIPs have been key in pushing the efficiency and form factor targets for portable electronics as well as for enhancing the overall system robustness and reliability for harsher industrial and automotive applications. Increasingly mature SiC and GaN power technology along with heterogeneous integration is helping achieve enormous power density enhancement even for higher voltage applications.