Solder volume effects on fatigue life of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu interconnects

2012 14th International Conference on Electronic Materials and Packaging (EMAP) Pub Date : 2012-12-01 DOI:10.1109/EMAP.2012.6507908

H. Qin, Xunping Li, Xin-Ping Zhang

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引用次数: 2

Abstract

The influence of solder volume on fatigue life of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu interconnects of different standoff heights under displacement cyclic loading conditions was studied by finite element (FE) simulation. The geometry of BGA structure solder interconnect was predicted according to the minimum energy principle by FE analysis, and simulation results reveal that the influence of gravity on the geometry of BGA structure solder interconnects can be reasonably ignored when the diameters of solder balls used are less than 0.76 mm. Darveaux's methodology based on plastic strain energy density was employed to predict the fatigue life of solder interconnects of different volumes by FE method. The simulation results show that the decreasing standoff height (i.e., solder volume) of joints can obviously increase the fatigue life of BGA structure solder interconnects, and the value and distribution of accumulated equivalent plastic strain play critical roles in determining the fatigue life of BGA structure solder interconnects.

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焊料体积对BGA结构Cu/Sn-3.0Ag-0.5Cu/Cu互连疲劳寿命的影响

采用有限元模拟研究了位移循环加载条件下，焊料体积对BGA结构Cu/Sn-3.0Ag-0.5Cu/Cu互连体不同间距高度疲劳寿命的影响。通过有限元分析，根据最小能量原理预测了BGA结构焊点互连的几何形状，仿真结果表明，当使用的焊点球直径小于0.76 mm时，重力对BGA结构焊点互连几何形状的影响可以合理忽略。采用基于塑性应变能密度的Darveaux方法，采用有限元法预测不同体积焊点的疲劳寿命。仿真结果表明，降低焊点的高度(即焊料体积)可以明显提高BGA结构焊点的疲劳寿命，而累积等效塑性应变的大小和分布对BGA结构焊点的疲劳寿命起着至关重要的作用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2012 14th International Conference on Electronic Materials and Packaging (EMAP)

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