Repairing of faulty TSVs using available number of multiplexers in 3D ICs

Abstract

Through-silicon via (TSV) based 3D integrated circuit (IC) testing is promising area to the researchers in modern day semiconductor industry. The manufacturing of 3D ICs may produce TSV defects which reduce yield. Recent work has proposed grouping of functional and redundant TSVs such that the faulty functional TSVs are supported by redundant TSVs and multiplexers (MUXs) are used to implement that group. This paper proposes grouping of functional and redundant TSVs such that a functional TSV is supported by redundant TSVs of other groups. We have presented an algorithm that finds the best grouping of functional and redundant TSVs such that maximum recovery of functional TSVs can be achieved with a given number of MUXs.