Modeling Analysis of RF Interconnection Technology Using ACF

Abstract

Anisotropic conductive film (ACF) is inserted within a transmission line between a ball grid array (BGA) packaging device and the attaching printed circuit board (PCB) to realize the temporary high density electrical interconnection. The ACF consists of metal wires and resin. Interconnect system constructed by Device-ACF-PCB was modeled in HFSS software. Several factors including film placing position, film thickness, diameter of conductive wire, wire inclination angle and dielectric constant of resin were evaluated by discussing their influences on electrical performance of interconnection with frequency up to 40 GHz.