Chih-Cheng Chuang, Kuan-I Cheng, S. Wu, Lung-Shu Huang, Bang-Cheng Chiu
{"title":"Novel correctable testing interface for high speed/frequency device testing","authors":"Chih-Cheng Chuang, Kuan-I Cheng, S. Wu, Lung-Shu Huang, Bang-Cheng Chiu","doi":"10.1109/EPTC.2016.7861571","DOIUrl":null,"url":null,"abstract":"The socket is regarded as a testing interface. It can measure the performance of package and fix the signal path from ATE to DUT (Device under Test). With testing frequency getting higher and higher, it will cause SI (Signal Integrity) problem when testing. The signal can't transmit completely with high frequency because of the excessive loss. Therefore, to solve this problem, use de-embedding method to remove effects caused by the socket and the load board. To simplify these complicated steps, this paper proposes the calibration kits to apply on the socket especially. Move the reference plane from the two sides of the load board to the tip of pogo pins. And use SOLT calibration method to have a standard definition table. As a result, tester can use this table to extract the error from tester and signal path and the error can be modified. In this way, tester can measure the performance of DUT directly.","PeriodicalId":136525,"journal":{"name":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","volume":"39 12","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2016.7861571","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The socket is regarded as a testing interface. It can measure the performance of package and fix the signal path from ATE to DUT (Device under Test). With testing frequency getting higher and higher, it will cause SI (Signal Integrity) problem when testing. The signal can't transmit completely with high frequency because of the excessive loss. Therefore, to solve this problem, use de-embedding method to remove effects caused by the socket and the load board. To simplify these complicated steps, this paper proposes the calibration kits to apply on the socket especially. Move the reference plane from the two sides of the load board to the tip of pogo pins. And use SOLT calibration method to have a standard definition table. As a result, tester can use this table to extract the error from tester and signal path and the error can be modified. In this way, tester can measure the performance of DUT directly.