A thermoreflectance thermography system for measuring the transient surface temperature field of activated electronic devices

P. Komarov, M. Burzo, P. Raad
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引用次数: 22

Abstract

This work reports on a system that can determine the thermal behavior of an activated complex microelectronic device by measuring its surface temperature field with a thermoreflectance-based system. The article describes the features of the experimental setup, provides details of the calibration process used to map the changes in the measured surface reflectivity to absolute temperature values, and explains the data acquisition procedure used to measure the transient temperature over a given active region of interest. The method is applied to determine the thermal behavior of actual MOSFET devices. First, the method is used to measure an activated MOSFET device and show that by scanning first and then switching the source and drain contacts, the two resulting steady state temperature scans are symmetrical. The method is then used to differentiate between the transient thermal behavior of identically activated devices that have been made on two different epitaxial layers, one with natural silicon and the other with isotopically-pure silicon
一种用于测量活化电子器件瞬态表面温度场的热反射热成像系统
本工作报告了一个系统,该系统可以通过基于热反射的系统测量其表面温度场来确定激活的复杂微电子器件的热行为。本文描述了实验装置的特点,提供了用于将测量表面反射率的变化映射到绝对温度值的校准过程的细节,并解释了用于测量给定感兴趣的活动区域的瞬态温度的数据采集程序。该方法被用于确定实际MOSFET器件的热行为。首先,该方法用于测量一个激活的MOSFET器件,并表明通过先扫描然后切换源极和漏极触点,得到的两个稳态温度扫描是对称的。然后,该方法用于区分在两种不同外延层(一种外延层为天然硅,另一种外延层为同位素纯硅)上制造的相同活化器件的瞬态热行为
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