Application of Matching Structures to Identify the Source of Systematic Dimensional Offsets in GHOST Proximity Corrected Photomasks

S. Smith, A. Tsiamis, M. Mccallum, A. Hourd, J. Stevenson, A. Walton
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引用次数: 2

Abstract

The effects of the GHOST proximity correction process on chrome-on-quartz photomasks can prove difficult to quantify and so they are not routinely characterised. This paper presents a methodology for addressing this issue using electrical test structures designed to measure dimensional mismatch. In the past these have been used successfully to characterise standard GHOSTed photomasks, which displayed systematic offsets that were not seen on an unGHOSTed mask using the same design. In order to investigate this further, a second mask was fabricated using a variation of the GHOST process which increased the resolution of the secondary exposure to be the same as the primary pattern. This enabled the source of the previously observed systematic offset to be determined as test structures on the new mask did not show the same overall dimensional bias. However, the range of mismatch in some of the structures was increased as a result of the new process.
匹配结构在GHOST接近校正光掩模系统尺寸偏移源识别中的应用
GHOST接近校正过程对铬-石英光掩膜的影响很难量化,因此它们没有常规表征。本文提出了一种解决这一问题的方法,使用设计用于测量尺寸不匹配的电气测试结构。在过去,这些已经被成功地用于表征标准的GHOSTed掩模,它显示了在使用相同设计的unhosted掩模上看不到的系统偏移。为了进一步研究这一点,使用GHOST工艺的一种变体制作了第二个掩模,该掩模增加了二次曝光的分辨率,使其与初级模式相同。这使得之前观察到的系统偏移的来源得以确定,因为新掩模上的测试结构没有显示出相同的总体尺寸偏差。然而,由于新工艺,某些结构的不匹配范围增加了。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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