Fabrication of AlGaN/GaN HFET with a high breakdown voltage of over 1050 V

S. Yoshida, Jiang Li, H. Takehara, H. Kambayashi, N. Ikeda
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引用次数: 10

Abstract

We performed an AlGaN/GaN Schottky barrier diode (SBD) with a high breakdown voltage of over 1000V on Si (111) substrate. An AlGaN/GaN heterostructure without any crack was realized on a Si (111) substrate using a metalorganic chemical vapor deposition (MOCVD). We also fabricated an AlGaN/GaN heterojunction field effect transistor (HFET) using an AlGaN/GaN heterostructure on a Si (111) substrate. The fabrication process was the same as SBD. The gate length and width were 2000 nm and 0.4 mm, respectively. The distance of gate and drain was 15000 nm. The off-state breakdown voltage of the HFET was over 1050V
击穿电压超过1050 V的AlGaN/GaN HFET的制备
在Si(111)衬底上制备了击穿电压超过1000V的AlGaN/GaN肖特基势垒二极管(SBD)。采用金属有机化学气相沉积(MOCVD)技术在Si(111)衬底上制备了无裂纹的AlGaN/GaN异质结构。我们还在Si(111)衬底上利用AlGaN/GaN异质结构制备了AlGaN/GaN异质结场效应晶体管(HFET)。制作过程与SBD相同。栅长为2000 nm,栅宽为0.4 mm。栅极与漏极的距离为15000 nm。HFET的断态击穿电压大于1050V
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