Generation of 3-dimensional power modules for high temperature applications by thermal copper coating processes

Abstract

The market of power electronics is a rapidly growing field with many new trends and technologies. Rising junction temperatures, progressive miniaturization and high demanding application environments result in increasing requirements regarding the efficiency, lifetime expectation and flexibility of modern power electronic devices. Therefore, a novel approach to adapt the 3-dimensional mechatronic integrated device (3D-MID) technology has been investigated. By combining innovative metallization processes like plasma-based coating technologies with robust substrate materials such as ceramics and superior interconnection technologies like pressureless silver-sintering, the manufacturing of highly integrated and highly efficient power modules will be evaluated. Therefore, a ceramic substrate is coated with a selective structured copper layer to generate the electric circuit path on which the bare-die components like sensors or power switches are mounted. The top-level interconnection can be generated by standard process like Al-wire bonding or even Cu-wire bonding technologies. Since the current industry standard, is almost at its limit with regards to space efficient module design and thermal management capabilities. This approach enables even the design of spatial circuit carries which allows an improved freedom of design concerning the functional integration in small spaces at harsh environments, while the usage of high performance materials and processes expands current limitations regarding as well the operating temperature and ambient temperature.