LDMOS implementation in a 0.35 /spl mu/m BCD technology (BCD6)

A. Moscatelli, A. Merlini, G. Croce, P. Galbiati, C. Contiero
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引用次数: 60

Abstract

This paper presents the integration approach followed to implement power LDMOS' up to 60 V into a 0.35 /spl mu/m process technology (BCD6) based on a CMOS plus Flash-Memory platform of equivalent lithography generation, built on a P-over P+ substrate. Experimental results on LDMOS' in terms of on-state specific resistance, off and on-state breakdown voltage, frequency behavior will be described analyzing the interactions between low voltage ULSI platform and high voltage power elements.
0.35 /spl mu/m BCD技术(BCD6)中的LDMOS实现
本文介绍了基于等效光刻生成的CMOS + Flash-Memory平台,基于P-over - P+衬底的0.35 /spl mu/m工艺技术(BCD6)实现高达60 V功率LDMOS的集成方法。本文将描述LDMOS在导通比电阻、关断和导通击穿电压、频率行为等方面的实验结果,分析低压ULSI平台与高压功率元件之间的相互作用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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