Sang-Yun Kim, T. Park, Jae-Sung Lee, Donggun Park, Kinam Kim, Jongho Lee
{"title":"Negative bias temperature instability(NBTI) of bulk FinFETs","authors":"Sang-Yun Kim, T. Park, Jae-Sung Lee, Donggun Park, Kinam Kim, Jongho Lee","doi":"10.1109/RELPHY.2005.1493143","DOIUrl":null,"url":null,"abstract":"We investigated the negative bias temperature instability (NBTI) of bulk FinFETs for the first time. Since the bulk FinFET has a body terminal, it is more flexible in studying the NBTI characteristics than the SOI FinFET (no body terminal). The dependence of NBTI on the back bias is smaller in a 100 nm bulk FinFET with a fin width of 30 nm than in conventional planar channel devices. The bulk FinFET with a side surface orientation of (100) showed better NBTI than the device with an orientation of [110]. The fin width was shown to have little impact on NBTI in the bulk FinFET. Moreover, the device with longer channel showed less degradation.","PeriodicalId":320150,"journal":{"name":"2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual.","volume":"111 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.2005.1493143","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
We investigated the negative bias temperature instability (NBTI) of bulk FinFETs for the first time. Since the bulk FinFET has a body terminal, it is more flexible in studying the NBTI characteristics than the SOI FinFET (no body terminal). The dependence of NBTI on the back bias is smaller in a 100 nm bulk FinFET with a fin width of 30 nm than in conventional planar channel devices. The bulk FinFET with a side surface orientation of (100) showed better NBTI than the device with an orientation of [110]. The fin width was shown to have little impact on NBTI in the bulk FinFET. Moreover, the device with longer channel showed less degradation.