Sheng Liu, Xiaojun Wang, Bin Ma, Zhiyan Gan, Honghai Zhang
{"title":"Drop Test and Simulation of Portable Electronic Devices","authors":"Sheng Liu, Xiaojun Wang, Bin Ma, Zhiyan Gan, Honghai Zhang","doi":"10.1109/ICEPT.2005.1564699","DOIUrl":null,"url":null,"abstract":"Portable electronics devices are well known to be susceptible to drop impact which can cause various damage modes such as interconnect breakage, battery separation, possible cracking/debonding along interfaces, display damage, leaking in insulin pump, etc. Drop/impact performance of these products is one of important concerns of product design. Because of the small size of this type of electronics products, it is very expensive, time-consuming and difficult to conduct drop tests to directly detect the failure mechanisms and identify their drop behaviors. The experiment test and the modeling simulation study are conducted to investigate the effect of drop impact of portable electronic devices. A sample pump as an example is used for drop impact test. Of interest is the measurement of the level of shock and the impact orientation experienced by the electronic components in the insulin pump during impact. The drop impact responses examined are compared with the modeling simulation results. Also, another simulation modeling of the cellphone is given with particular focus on the material rate dependent constitute modeling, and nonlinear contact mechanics based modeling. Maximum impact accelerations and impact forces demonstrated with various impact orientations shows what is the relative reliability of cellphone during the different impact situations","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 6th International Conference on Electronic Packaging Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2005.1564699","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 20
Abstract
Portable electronics devices are well known to be susceptible to drop impact which can cause various damage modes such as interconnect breakage, battery separation, possible cracking/debonding along interfaces, display damage, leaking in insulin pump, etc. Drop/impact performance of these products is one of important concerns of product design. Because of the small size of this type of electronics products, it is very expensive, time-consuming and difficult to conduct drop tests to directly detect the failure mechanisms and identify their drop behaviors. The experiment test and the modeling simulation study are conducted to investigate the effect of drop impact of portable electronic devices. A sample pump as an example is used for drop impact test. Of interest is the measurement of the level of shock and the impact orientation experienced by the electronic components in the insulin pump during impact. The drop impact responses examined are compared with the modeling simulation results. Also, another simulation modeling of the cellphone is given with particular focus on the material rate dependent constitute modeling, and nonlinear contact mechanics based modeling. Maximum impact accelerations and impact forces demonstrated with various impact orientations shows what is the relative reliability of cellphone during the different impact situations