High-efficient and high-accurate chip to wafer bonding for size-free MEMS-IC integration by using fine patterned self-assembled monolayer

Abstract

A hydrophobic self-assembled monolayer (SAM) was applied for high-efficient chip to wafer self-alignment and bonding with reasonable high alignment speed (in millisecond) and high accuracy (≤ 1μm). Hydrophilic frame at the edge of each binding-site was demonstrated effective for a successful self-alignment, while superfine pattern at the center was used to control the bonding strength. The effects of Au/Cr wire were also studied to extend above approach for various MEMS-IC integration processes.