Electrically measurable test structures to capture and classify EUV stochastics

H. Vats, R. R. Kim, Y. Sherazi, Y. Drissi, K. Ronse
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Abstract

Advanced technology nodes are demanding aggressive printability using EUV. EUV printing process inherently brings in stochastic defects. To measure and experience various types of Stochastics in EUV printing, high volume measurements are deemed necessary. Furthermore the classification of the defects in terms of stochastic and systematic is also required. The permutation and combinations of shapes, sizes, and proximity driven stochastics errors are high in numbers, leading to significant increase in the number of test structures needed. Without electrically measurable solutions, the defect test measurement exercise becomes impractical to perform visually. This paper will describe few examples of developing and handling the test structures capable to capture the defects and defect location and further to classify the defects in terms of stochastic or systematic defects.
用于捕获和分类EUV随机特性的电可测量测试结构
先进的技术节点要求使用EUV具有侵略性的打印性。极紫外印刷工艺本身就存在一些随机缺陷。为了测量和体验EUV打印中的各种类型的随机性,高容量测量被认为是必要的。此外,还需要对缺陷进行随机和系统的分类。形状、大小和邻近驱动的随机误差的排列和组合在数量上很高,导致所需测试结构的数量显著增加。如果没有电可测量的解决方案,缺陷测试测量工作将变得不切实际。本文将描述一些开发和处理测试结构的例子,这些测试结构能够捕获缺陷和缺陷位置,并进一步根据随机缺陷或系统缺陷对缺陷进行分类。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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