{"title":"Performace modeling and optimization for on-chip interconnects in memory arrays","authors":"J. Mohseni, C. Pan, A. Naeemi","doi":"10.1109/EPEPS.2015.7347150","DOIUrl":null,"url":null,"abstract":"Performance modeling and optimization for on-chip interconnects in DRAM arrays are presented at various technology generations. Multiple interconnect design schemes and novel interconnect technology options are investigated to minimize the overall delay and energy-delay product.","PeriodicalId":130864,"journal":{"name":"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2015.7347150","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Performance modeling and optimization for on-chip interconnects in DRAM arrays are presented at various technology generations. Multiple interconnect design schemes and novel interconnect technology options are investigated to minimize the overall delay and energy-delay product.