Monitoring test structure for plasma process induced charging damage using charge-based capacitance measurement (PID-CBCM)

S. Mori, K. Ogawa, H. Oishi, Tsuyoshi Suzuki, Manabu Tomita, M. Bairo, Y. Fukuzaki, H. Ohnuma
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引用次数: 1

Abstract

We propose monitoring test structure and measurement technique for plasma process induced charging damage (PID) using charge-based capacitance measurement (CBCM). For evaluating the influence of PID on MOSFET effectively, remarkably small (several tens of fF) gate capacitance of MOSFET can be extracted by eliminating parasitic antenna capacitance. Moreover, we can extract interface trap density from the same CBCM structure using the modified Charge-Pumping measurement.
基于电荷电容测量(PID-CBCM)的等离子体过程充电损伤监测试验结构
提出了基于电荷电容测量(CBCM)的等离子体过程诱导充电损伤(PID)监测测试结构和测量技术。为了有效地评估PID对MOSFET的影响,通过消除天线寄生电容,可以提取非常小(几十fF)的MOSFET栅极电容。此外,我们可以利用改进的电荷泵送测量方法从相同的CBCM结构中提取界面陷阱密度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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