Impact of scaling on the performance and reliability degradation of metal-contacts in NEMS devices

H. Dadgour, M. Hussain, A. Cassell, Navab Singh, K. Banerjee
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引用次数: 22

Abstract

Nano-electro-mechanical switches (NEMS) offer new possibilities for the design of ultra energy-efficient systems; however, thus far, all the fabricated NEMS devices require high supply voltages that limit their applicability for logic designs. Therefore, research is being conducted to lower the operating voltages by scaling down the physical dimensions of these devices. However, the impact of device scaling on the electrical and mechanical properties of metal contacts in NEMS devices has not been thoroughly investigated in the literature. Such a study is essential because metal contacts play a critical role in determining the overall performance and reliability of NEMS. Therefore, the comprehensive analytical study presented in this paper highlights the performance and reliability degradations of such metal contacts caused by scaling. The proposed modeling environment accurately takes into account the impact of roughness of contact surfaces, elastic/plastic deformation of contacting asperities, and various inter-molecular forces between mating surfaces (such as Van der Waals and capillary forces). The modeling results are validated and calibrated using available measurement data. This scaling analysis indicates that the key contact properties of gold contacts (resistance, stiction and wear-out) deteriorate “exponentially” with scaling. Simulation results demonstrate that reliable (stiction-free) operation of very small contact areas (≈ 6nm × 6nm) will be a daunting task due to the existence of strong surface forces. Hence, contact degradation is identified as a major problem to the scaling of NEMS transistors.
缩放对NEMS器件中金属触点性能和可靠性退化的影响
纳米机电开关(NEMS)为超节能系统的设计提供了新的可能性;然而,到目前为止,所有制造的NEMS器件都需要高电源电压,这限制了它们在逻辑设计中的适用性。因此,研究人员正在通过缩小这些设备的物理尺寸来降低工作电压。然而,器件结垢对NEMS器件中金属触点电气和机械性能的影响尚未在文献中得到深入研究。这样的研究是必要的,因为金属触点在决定NEMS的整体性能和可靠性方面起着关键作用。因此,本文提出的综合分析研究强调了这种金属触点因结垢而导致的性能和可靠性下降。所提出的建模环境准确地考虑了接触面粗糙度、接触颗粒的弹/塑性变形以及配合面之间的各种分子间力(如范德华力和毛细力)的影响。利用现有的测量数据对建模结果进行了验证和校准。这种结垢分析表明,金触点的关键接触性能(电阻、粘滞和磨损)随着结垢呈指数级恶化。仿真结果表明,由于存在强大的表面力,非常小的接触面积(≈6nm × 6nm)的可靠(无粘)操作将是一项艰巨的任务。因此,接触退化被确定为NEMS晶体管缩放的主要问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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