Characterization of a Burn-in Failure Caused by a Defective Source Driver on TFT-LCD Panel

F.‐S. Wang, Keh-La Lin, K. Tso, Chin-Chieh Chao, W.W. Wang, Alan Yu, C.Y. Lee, Chien Hung Kuo, C.W.A. Wang, Yi Chiu
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引用次数: 0

Abstract

This paper describes a thorough investigation to identify the root cause of an LCD panel burn-in failure induced by an LCD source driver, which is observed in a large-scale LCD factory producing more than one million LCD panels per month. The investigation demonstrates the effectiveness of the circuit simulation to precisely locate the defective spot which is caused by a metal slice originated from outer rings of an LCD COG (chip-on-glass) source driver. With the aid of emission microscope (EMMI), energy dispersive analysis X-ray (EDAX), and chip probing (CP) tester, the root cause of the failure is well explained. The formation mechanism of metal slice from the outer rings is thoroughly studied. A solution to completely eliminate the source of metal slices from the outer rings during wafer processing is also proposed
TFT-LCD面板上由缺陷源驱动引起的老化故障的表征
本文描述了一项彻底的调查,以确定由LCD源驱动器引起的LCD面板烧坏故障的根本原因,这是在一家每月生产100多万块LCD面板的大型LCD工厂中观察到的。研究结果表明,该电路仿真能够精确定位由LCD COG (chip-on-glass)源驱动器外环产生的金属片引起的缺陷点。借助发射显微镜(EMMI)、能量色散分析x射线(EDAX)和芯片探针(CP)测试仪,对失效的根本原因进行了较好的解释。深入研究了外圈金属片的形成机理。提出了一种完全消除晶圆加工过程中外圈金属片来源的解决方案
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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